CHIPMOS TECHNOLOGIES INC
Business
CHIPMOS TECHNOLOGIES INC is an independent provider of semiconductor assembly, gold bumping and testing services focused on memory, logic/mixed-signal and display driver semiconductors. It offers testing (wafer probing, burn-in, final test), a broad range of assembly services (leadframe- and organic substrate-based packages, WLCSP, flip-chip, COF and COG) and bumping services (gold, RDL, Cu pillar) plus drop shipment and testing software services. Key business segments include testing, assembly, display panel driver assembly/testing and bumping, supported by R&D and vertically integrated turnkey solutions. The company primarily serves customers in Taiwan, with sales and marketing operations and customers across Japan, Mainland China, the United States, Singapore and other international markets.
Summary from filing dated 2025-04-15
Financials
Latest annual snapshot (FY2025, period end 2025-12-31). Full statement history unavailable for this entity.
| Revenue | — |
| Net income | $17.55M |
| Total assets | $1.45B |
| Total liabilities | $681.08M |
| Stockholders' equity | — |
| Operating cash flow | — |